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與英偉達搶佔AI芯片高地,AMD AI 活動即將到來
格隆匯 12-06 17:47

AMD將於太平洋時間12月6日上午10點(北京時間12月7日凌晨2點)舉辦名為“Advancing AI”的活動,推出MI300A和MI300X芯片。

屆時,AMD董事長兼CEO 蘇姿豐將與公司高管以及AMD的合作伙伴和客户等一起探討AMD的產品和軟件。

與英偉達搶佔AI芯片高地

據悉,MI300A產品形態採用CPU+GPU合封的chiplet方式,MI300X是專門針對AI的產品。

這次動作將不僅是代表AMD與英偉達在AI熱潮中展開競爭,更是AMD在AI領域的強勁進展,也有不少人認為隨着MI300X的發佈,新一輪的HBM3“軍備競賽”由此拉開帷幕。

從性能來看,對比競品,MI300有足夠的競爭力。

MI300算是目前AMD的最強AI芯片,性能能達到MI250X的8倍,不少的業內人士覺得或許是可以和英偉達的H100“打上一架”。

具體性能方面,MI300X擁有8組HBM3核心,顯存容量提升到了192GB,超過了英偉達近期發佈的H200,相當於NVIDIA H100 80GB的足足2.4倍。

而H200是首款提供HBM3e的GPU,顯存容量達到了141GB,可有效提高大模型訓練效果,將於明年的第二季度發貨。至於MI300已經在今年的第四季度開始交貨,AMD預估自己在明年AI相關的營收可達20億美元以上,並將MI300作為極大提高銷售額的王牌產品。

Wedbush Securities分析師在週二的一份研究報吿中表示,在此次活動中,AMD可能會比較其新款MI300芯片與英偉達H100的性能,特別是內存容量和帶寬。

台灣電子時報在今日報道中指出,預計AMD的MI300明年出貨量將達30萬至40萬顆,最大客户為微軟、谷歌。

上個月,英偉達宣佈了其最新、最強大的GPU H200,專為人工智能設計,儘管11月下旬發佈的報吿稱,由於服務器製造商集成問題,芯片製造商將推遲其新的人工智能芯片的發佈到2024年。英偉達芯片推遲上市之際,投資者擔心美國對中國芯片出口的限制是英偉達面臨的重大風險。

Wedbush在其報吿中指出,微軟可能會參與AMD的活動,因為微軟已經宣佈將AMD的新芯片添加到其雲計算部門Azure上。

Wedbush進一步指出,AMD可以從其目前的人工智能投資驅動的未來增長中受益,而與其競爭對手的芯片製造商相比,英偉達“很可能在中期內”從人工智能芯片中實現銷售增長。

傑富瑞分析師指出,隨着新的AI芯片可以讓AMD更好地與英偉達競爭,該分析師將這兩家芯片製造商稱為“首選”。

此前,CEO蘇姿豐在發佈會上表示:“我們仍處於人工智能生命週期的起步階段。到2027年,數據中心AI加速器的潛在市場總額將增長五倍,達到1500億美元以上,複合年增長率超50%,會有很大體量。”

蘇姿豐還表示:Instinct MI300能幫助公司佔領市場,其滿足了AI和HPC/超級計算生態系統的所有要求。在AMD乘勝追擊之下,英偉達一家獨大的市場格局或會發生轉變。

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