臺積電:擬明年下半年量產強化版N3P製程
臺積電(TSM.US)在北美技術論壇上宣佈,2納米制程在良品率和元件效能進展良好,將如期於2025年量產,並推出新3納米技術;其中,強化版3納米(N3P)製程預計明年下半年量產。
臺積電稱,相較於升級版3納米(N3E)製程技術,2納米在相同功耗下,速度最快將可增加15%;在相同速度下,功耗最多可降低30%,同時晶片密度增加逾15%。隨着3納米制程已進入量產,N3E製程預計於今年量產,臺積電進一步推出更多3納米技術以滿足客戶多樣化的需求。
公司表示,強化版3納米預計於明年下半年進入量產,相較於N3E製程,在相同功耗下,速度增快5%;在相同速度下,功耗降低5%至10%,晶片密度增加4%。
另外,臺積電亦發佈了3D芯片堆疊方案SoIC-P,最新版本的開放式標準設計語言3Dblox 1.5等。(ca/k)
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