MWC2025：全球首款外折屏筆記本電腦亮相，聯想再度玩出新高度
2025年世界移動通信大會(MWC 2025)正式拉開帷幕，聯想推出一系列搭載人工智能的最新設備，其中ThinkBook Flip AI PC概念機成爲大會最受關注產品之一，這是全球首款OLED外折屏筆記本電腦，其可以實現智能化辦公、多屏協同及智能工作空間適配。
ThinkBook Flip AI PC概念機承襲聯想在AI商用計算領域的創新基因，代表着AI驅動形態變革的又一次突破，成爲MWC 2025展會的核心產品之一。
這款概念設備採用18.1英寸外折式OLED顯示屏，可從緊湊的13英寸筆記本形態切換至縱向擴展的工作空間，優化生產力、提升多任務處理能力，並增強AI協作體驗。其革命性的設計支持五種模式自由切換，包括：筆記本模式、豎屏模式、分享模式、平板模式、閱讀模式。
ThinkBook Flip AI PC概念機集成AI智能多任務處理功能，支持工作區分屏，可同時運行多個應用，減少對外接顯示器的依賴。搭載英特爾酷睿Ultra 7處理器、32GB LPDDR5X內存及PCIe SSD存儲，確保流暢的AI計算性能。同時，全新三層發光Smart ForcePad智能壓感觸控板新增數字鍵與多媒體控制功能，提升交互體驗。Thunderbolt 4接口與指紋識別增強商務級安全防護，爲未來混合辦公提供全新範式。
同時，聯想ThinkPad和ThinkBook AI PC系列全面升級，包括ThinkPad X13 Gen 6、ThinkPad T14s 2合1及ThinkBook 16p Gen 6。ThinkPad T、E系列及ThinkBook 14 2合1 Gen 5也迎來煥新升級。聯想還展示了Magic Bay生態系統，推出模塊化可連接配件，如Magic Bay Tiko智能交互設備、Magic Bay雙屏、Magic Bay 迷你副屏等，助力創新計算體驗。
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