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東風集團股份(00489.HK):智新半導體IGBT模塊正式投產
格隆匯 07-14 06:17

格隆匯7月14日丨東風集團股份(00489.HK)發佈公吿,近日,華中地區首隻量產的車規級IGBT模組產品,從智新科技股份有限公司的智新半導體模組封裝工廠下線,這是東風汽車集團自主掌控新能源汽車關鍵技術核心資源的重要實踐,也是東風汽車集團與中國中車戰略合作的第一個碩果。

2019年6月,智新科技(東風汽車集團持股82%)與中國中車在武漢合資成立智新半導體有限公司,旨在實現IGBT核心資源自主掌控。其中,智新科技持有智新半導體53%股權。在雙方的共同努力下,歷時兩年,一條以國際一流的第六代IGBT技術為基礎的汽車用功率半導體生產線在東風新能源汽車產業園一號園建成,首批產品正式下線。智新半導體專案總規劃產能120萬隻,一期將實現每年30萬隻全轎車規級模組的封裝能力,建成功率半導體產業化基地。

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