传PS5主晶片改款导入6nm
据台湾传媒引述供应链消息指,Sony(SONY.US)PS5将轻微改款,据悉改款的PS5半客制化主晶片将采用台积电(TSM.US)7nm家族的6nm制程,预期最快於明年第二至第三季,晶片端的後段封测部分将备战完毕。
报道引述业内人士指,PS5目前销售好过市场预期,近月7nm半客制化主晶片封测总量大约维持在80万套左右,以今年全年IC封测量估计,未来有机会突破1,000万套水平。
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