《大行報告》中金:內地支持半導體全產業鏈加速發展 長期利好集成電路業
中金發表報告表示,國務院於發布了《新時期促進集成電路產業和軟件產業高質量發展的若干政策》,和現有政策相比,看到以下三點變化,第一是在現有的「五免五減半」政策基礎上,首次推出十年免徵所得稅政策,支持28nm及以下先進工藝生產企業發展;第二是把「兩免三減半」政策適用範圍從過去的芯片設計擴大到封裝、設備、材料全產業鏈,同時對重點設計及軟件企業稅收優惠加大;第三是與生產相關的原材料等產品進口關稅免除政策繼續施行,明確設備免稅條件。此外,人才政策方面,第一次明確把集成電路列入「一級學科」,並對產教融合企業提出明確稅收優惠。該行認為新政策的落地長期利好中國集成電路行業發展,加速半導體國產化進程。
該行表示,具體來看,對於28nm及以下線寬的企業或項目,適用「十年免稅」政策;對於28nm至65nm的企業或項目,適用「五免五減半」政策;對於65nm至130nm(包含)的企業或項目,使用「兩免三減半」政策。該行認為,目前華虹集團旗下的華力微電子(未上市)、合肥長鑫(未上市)等企業有望直接受益。
中金稱,新政策明確指出,對集成電路線寬小於65nm(含)/特色工藝線寬小於0.25um(含)化合物半導體工藝線寬小於0.5um(含)先進封裝測試企業的生產相關原材料、消耗品等進口關稅繼續免除。同時,明確對符合規定的企業進口自用設備實行關稅免除。該行認為此舉有望繼續降低領先的半導體制造及封裝企業生產成本其過去數年行業地位提升得到進一步鞏固。
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