立昂微(605358.SH)：擬取得國晶半導體的控制權 其主要產品爲集成電路用12英寸硅片
格隆匯3月9日丨立昂微(605358.SH)公佈，公司的控股子公司金瑞泓微電子與康峯投資、柘中股份、國晶半導體簽署了《關於國晶(嘉興)半導體有限公司之股權收購協議》，金瑞泓微電子擬以現金方式收購康峯投資持有的國晶半導體14.25%股權及柘中股份持有的國晶半導體44.44%股權。金瑞泓微電子與康峯投資另外簽署了《嘉興康晶半導體產業投資合夥企業(有限合夥)合夥企業財產份額轉讓協議》。由金瑞泓微電子受讓康峯投資持有的嘉興康晶46.6667%的財產份額。
受讓國晶半導體股權支付的股權轉讓價款系根據天源資產評估有限公司出具的《金瑞泓微電子(衢州)有限公司擬收購股權涉及的國晶(嘉興)半導體有限公司股東全部權益價值資產評估報告》(天源評報字[2022]第0054號)載明的截至評估基準日(2021年12月31日，下同)的股權評估價值由交易各方協商確定。金瑞泓微電子應向柘中股份支付國晶半導體股權轉讓價款35259.27萬元、向康峯投資支付國晶半導體股權轉讓價款27784.58萬元，上述股權轉讓價款爲人民幣63043.85萬元；金瑞泓微電子另向康峯投資支付嘉興康晶合夥企業份額轉讓價款爲人民幣38173.66萬元。除此以外，鑑於康峯投資、柘中股份持有的國晶半導體認繳出資額尚未全部實繳完成，交割完成後金瑞泓微電子應當向國晶半導體支付投資款合計47250萬元。綜上，此次收購交易總價款爲148467.51萬元。
收購完成後，金瑞泓微電子將直接持有國晶半導體58.69%的股權，此外，因嘉興康晶持有國晶半導體41.31%的股權，公司通過持有嘉興康晶46.6667%的財產份額可間接持有國晶半導體19.28%的股權。通過直接及間接的方式持有國晶半導體77.97%的股權，公司將取得國晶半導體的控制權。
公告顯示，國晶半導體主要產品爲集成電路用12英寸硅片，目前已完成月產40萬片產能的全部基礎設施建設，生產集成電路用12英寸硅片全自動化生產線已貫通，目前處於設備安裝調試、客戶導入和產品驗證階段。目前國晶半導體處於客戶導入和產品驗證階段，尚未取得營業收入，截至2021年12月31日處於虧損狀態，預計國晶半導體客戶導入和產品驗證完成後將取得良好業績。該收購事項符合國家關於相關產業整合及資源共享的要求，有利於實現節能降耗目標、減少同行業競爭、優化配置。有利於快速擴大公司現有的集成電路用12英寸硅片的生產規模，實現優勢互補、資源共享。提高公司在集成電路用12英寸硅片尤其是存儲、邏輯電路用輕摻硅片的市場地位，符合公司的發展戰略和長遠規劃，符合公司全體股東的利益。
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